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HF115AC-0.0055-AC-58Quantity:6551

Part No HF115AC-0.0055-AC-58
Manufacturer Bergquist
Description THERM PAD 19.05MMX12.7MM W/ADH
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Thermal Conductivity:0.8 W/m-K
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Adhesive:Adhesive - One Side
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:2 Weeks
Shape:Rectangular
Thermal Resistivity:0.35°C/W
Email:[email protected]
Outline:19.05mm x 12.70mm
Color:Gray
Series:Hi-Flow® 115-AC
Usage:TO-220
Type:Pad, Sheet
Thickness:0.0055" (0.140mm)
Other Names:BER168 BG426642 HF115AC-58 HF115AC00055AC58 HF115TAAC-58
Material:Phase Change Compound
Backing, Carrier:Fiberglass

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We can supply HF115AC-0.0055-AC-58 , send us a request quote to request HF115AC-0.0055-AC-58 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HF115AC-0.0055-AC-58.The price and lead time for HF115AC-0.0055-AC-58 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HF115AC-0.0055-AC-58.We look forward to working with you to establish long-term relations of cooperation