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69-11-42339-T777Quantity:24343

Part No 69-11-42339-T777
Manufacturer Parker Chomerics
Description THERMAFLOW 28X28MM SOLDER HYBRID
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Thermal Conductivity:-
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Thermal Pad Gray 28.00mm x 28.00mm Square Tacky - Both Sides
Adhesive:Tacky - Both Sides
Moisture Sensitivity Level (MSL):Not Applicable
Manufacturer Standard Lead Time:4 Weeks
Shape:Square
Thermal Resistivity:-
Email:[email protected]
Outline:28.00mm x 28.00mm
Color:Gray
Series:THERMFLOW® T777
Usage:-
Type:Gap Filler Pad, Sheet
Thickness:0.0045" (0.115mm)
Other Names:1944-1285 69-11-42339-T777-DK
Material:Polymer Solder Hybrid
Backing, Carrier:-

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